0
2010 Design of Medical Devices Conference Abstracts

Miniature Implantable Pressure Sensors for Medical Applications OPEN ACCESS

[+] Author and Article Information
Robert Stone

Tronics MedTech, Inc.

FranÃois Gardien, Antoine Filipe, Christian Pisella, Alain Roggi, Franà ois-Xavier Boillot

Tronics SA

J. Med. Devices 4(2), 027507 (Aug 09, 2010) (1 page) doi:10.1115/1.3442441 History: Published August 09, 2010; Online August 09, 2010

Abstract

Pressure sensors are requisite for many medical implantable devices to monitor physiological pressures or fluid pressure and flow from a subsystem. Size, power consumption, accuracy, sensitivity, stability, and biocompatibility are all key considerations in the design and fabrication of such sensors. Conventional designs, based on piezoresistive technologies, are power consuming with significant drift and temperature error, whereas capacitive solutions are often cumbersome when packaged for biocompatibility. Tronics Microsystems has developed absolute pressure sensors, which achieve the benefits of both technologies. Miniaturization is achieved using a MEMS sensing element and a multifunction ASIC with small form factors. Low power consumption, low drift, high resolution, and waveform capture capability are obtained by using a capacitive MEMS coupled with a sigma-delta, direct capacitance to digital converter. Biocompatibility is achieved with grade II titanium packaging in two form factors (“tubular” or “pancake”) for incorporation into various applications. These sensors have been fabricated, calibrated, and tested extensively over physiologic temperature ranges. The design has achieved power consumption lower than 500ÂμW at 100 Hz and a drift lower than 0.5% full scale per year. An accuracy of +/1% full scale, over the temperature range is obtained by on-ASIC nonlinearity and temperature compensation. The two packaging configurations allow analysis of the trade-offs on the temperature range, sensitivity, volume, sterilization, etc. Different feed-through materials permit optimization of the form factors for the tube and the flat sensor and wired or wireless communication.

Copyright © 2010 by American Society of Mechanical Engineers
This article is only available in the PDF format.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In