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  • Proceedings Article July 16, 2013

    Ryan Lewis; Yunda Wang; Paul Schroeder; Collin Coolidge; Ray Radebaugh; Y. C. Lee

    Proc. ASME. 55751; Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005.July 16, 2013
    IPACK2013-73290
    doi: 10.1115/IPACK2013-73290