3D structural electronics is a new paradigm in fabricating electronics with high design complexity. Basically, manufacturing of 3D structural electronics consists of several processes: structure building, wire creation, and pick-and-place of electrical components. In this work, a 3D structure was built in a commercial AM machine, and conductive wires were created on the 3D structure with a predetermined design of an electronic circuit. Generally, 2D wire paths are projected to a 3D surface, and a tool path for the wire is generated in advance. And a direct printing device follows the tool path to draw the conductive wires on the surface, while a direct curing device simultaneously hardens the created wires using thermal/radiation energy. This direct printing/curing device was developed by combining a micro-dispensing device and a light focusing module installed in a motorized xyz stage. Several experiments were accomplished using photocrosslinkable materials filled with carbon nanotubes (CNTs). Finally, a 3D electronics prototype was fabricated to show the compelling evidence that the suggested manufacturing methods and materials would be promising in manufacturing 3D structural electronics.
Development of Direct Printing/Curing Process for 3D Structural Electronics
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Lu, Y, Vatani, M, Kim, H, Lee, R, & Choi, J. "Development of Direct Printing/Curing Process for 3D Structural Electronics." Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. Volume 2A: Advanced Manufacturing. San Diego, California, USA. November 15–21, 2013. V02AT02A005. ASME. https://doi.org/10.1115/IMECE2013-63068
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