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Keywords: heat transfer
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
... drop and temperatures of the heaters. multi-chip module liquid cooling heat sink data centers heat transfer Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26, 2023...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97266
... Abstract This study presents an experimental investigation on the nucleate boiling heat transfer (NBHT) in deionized (DI) water and HFE-7100 on bare copper surfaces. The experiments were performed under atmospheric condition at 0 and 10 K subcooling levels. The primary objective...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97446
... Abstract The objective of this study is to quantify heat transfer direct cooling channel enhancements in single phase for optimal cooling. A device is created to mitigate hot spots in high voltage and high-power density electronics. This design study is for power modules with high heat fluxes...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6391
... Abstract The use of computational fluid dynamics/heat transfer (CFD/HT) software has become common in exploring the thermal and hydrodynamic behavior of many electronic products. Well-designed CFD/HT models are very valuable for driving the product design, but accurate models can be difficult...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 261-272, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89065
... 07 01 2011 Heat transfer enhancement using segmented non-boiling gas-liquid streams is examined. Segmentation results in a two phase flow of liquid/gas having a constant liquid fraction, i.e. no phase change occurs. In this flow configuration, enhanced heat transfer occurs as a result...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 329-334, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33471
... of this coefficient is C ≈ 0.7∼0.95. For the demonstration, we designed the assembled-type two-phase cooling module with the optimum flow rate based on our model, and we observed that the evaporator had a relatively small thermal resistance of 0.1K/W. Boiling Heat transfer Evaporator Condenser Electronics...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 545-552, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73392
... 03 04 2009 Micro-jet array MEMS Finite difference method Impinging cooling device Heat transfer Compressible flow In this work ways to improve the performance of the MJA is investigated using computer modeling. Finite-difference method is used to analyze and understand...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1-9, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73003
... degassed (chamber pressure of 41.4 kPa) and gassy conditions (chamber with N 2 gas at 101 kPa) with a bulk fluid temperature of 20.5°C. Results for both the degassed and gassy cases show that structure width and separation distance have a dominant effect upon the heat transfer for the size ranges used...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 189-195, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73128
... transfer analytical method was proposed for both laminar and turbulent flows. The characterization data from these three parallel plate heat sinks were compared with the analytical methods. Finally, empirical heat transfer correlations were developed for both laminar and turbulent flows. Heat Sinks...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 111-117, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35055
... application challenges unique to LEDs. Conventional lighting methods provide little guidance for LED thermal problems since these usually involve a very high temperature source, such as a filament or an arc, and radiant heat transfer dissipates the thermal energy. LED junction temperatures are limited to much...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 73-80, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35020
... A series of experimental investigations with a new modified transient liquid crystal method on the studies related to the fluid flow and heat transfer characteristics in a channel installed with a heat sink have been successfully performed. The parametric studies on the local and average...