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Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Paper No: IPACK2022-97446
... specifically, SiC/Si-IGBT hybrid inverter systems requiring enhanced cooling. Experimental test for this heat sink device consists of flow loop tests through conventional hot plates with a first-generation heat sink device attached. This heat spreading device consists of an internal manifold design...