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Keywords: power modulesClose
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Paper No: IPACK2022-97446
... Abstract The objective of this study is to quantify heat transfer direct cooling channel enhancements in single phase for optimal cooling. A device is created to mitigate hot spots in high voltage and high-power density electronics. This design study is for power modules with high heat fluxes...
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A016, October 7–9, 2019
Paper No: IPACK2019-6443
... carbide technologies. Power modules of commercial traction inverters are analyzed for their within-package interconnect scheme, module architecture, and cooling methods. A few power module package architectures from both industry adopted standards and proposed patented technologies are compared...