It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.
- Nanotechnology Institute
Stress and Temperature Analysis of the Copper Substrate Indented With Nanotubes and Nanocones
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Wang, Y, Chen, J, Liao, M, Chen, C, Chen, Y, & Hwang, C. "Stress and Temperature Analysis of the Copper Substrate Indented With Nanotubes and Nanocones." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 587-589. ASME. https://doi.org/10.1115/MNHMT2009-18379
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