About the Journal
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Read more...
A Review on Transient Thermal Management of Electronic Devices
John Mathew and Shankar Krishnan
The ASME Open Journal of Engineering (AOJE) is a rapid turnaround, multidisciplinary, open access, and rigorously peer-reviewed publication that expands the ASME Journal Program to offer original research across the broad spectrum of all ASME technical communities.
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