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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. June 2023, 145(2): 021005.

Paper No: EP-22-1012

DOI: https://doi.org/10.1115/1.4055591

Published Online: September 28, 2022

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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali

J. Electron. Packag. March 2021, 143(1): 011008.

Paper No: EP-19-1117

DOI: https://doi.org/10.1115/1.4047341

Published Online: June 23, 2020

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Topics: Alloys, Fatigue, Fatigue life, Solder joints, Solders, Stress, Cycles, Energy dissipation, Fatigue properties, Reliability

Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu

J. Electron. Packag. March 2021, 143(1): 011003.

Paper No: EP-19-1078

DOI: https://doi.org/10.1115/1.4046762

Published Online: June 4, 2020

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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins

Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou

J. Electron. Packag. June 2019, 141(2): 020801.

Paper No: EP-18-1026

DOI: https://doi.org/10.1115/1.4041813

Published Online: February 25, 2019

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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry

Journal Articles

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang

J. Electron. Packag. December 2018, 140(4): 041002.

Paper No: EP-18-1007

DOI: https://doi.org/10.1115/1.4040670

Published Online: August 3, 2018

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Topics: Density, Design, Heat, Modeling, Optimization, Silicon, Temperature, Simulation, Energy dissipation, Gates (Closures)

Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo

J. Electron. Packag. September 2017, 139(3): 031003.

Paper No: EP-16-1108

DOI: https://doi.org/10.1115/1.4036066

Published Online: June 14, 2017

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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission

Journal Articles

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne

J. Electron. Packag. March 2016, 138(1): 010902.

Paper No: EP-15-1090

DOI: https://doi.org/10.1115/1.4032346

Published Online: March 10, 2016

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Topics: Energy dissipation, Experimental characterization, Heat transfer, Heating, Thermal conductivity, Thermal resistance, Thermal analysis, Cooling, Temperature, Temperature profiles

Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu

J. Electron. Packag. March 2012, 134(1): 014501.

DOI: https://doi.org/10.1115/1.4005908

Published Online: March 19, 2012

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Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection

Journal Articles

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Zhanyu Sun, Yogesh Jaluria

J. Electron. Packag. June 2011, 133(2): 021008.

DOI: https://doi.org/10.1115/1.4004218

Published Online: June 23, 2011

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Topics: Bronze, Gas flow, Heat flux, Heat transfer, Microchannels, Nitrogen, Slip flow, Temperature, Thermal conductivity, Silicon nitride ceramics

Journal Articles

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Yueguang Deng, Jing Liu

J. Electron. Packag. September 2010, 132(3): 031009.

DOI: https://doi.org/10.1115/1.4002012

Published Online: September 9, 2010

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Topics: Cooling, Design, Energy dissipation, Heat, Liquid metals, Pumps, Thermal resistance, Water, Flow (Dynamics), Engineering prototypes

Journal Articles

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Varghese Panthalookaran

J. Electron. Packag. September 2010, 132(3): 031007.

DOI: https://doi.org/10.1115/1.4002009

Published Online: September 9, 2010

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Topics: Computational fluid dynamics, Cooling, Energy dissipation, Flow (Dynamics), Heat, Temperature, Natural convection, MOSFET transistors, Separation (Technology), Optimization

Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin

J. Electron. Packag. December 2009, 131(4): 041009.

DOI: https://doi.org/10.1115/1.4000363

Published Online: November 12, 2009

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Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat

Journal Articles

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, D. Edwards

J. Electron. Packag. December 2009, 131(4): 044502.

DOI: https://doi.org/10.1115/1.4000208

Published Online: November 12, 2009

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Topics: Geometry, Solder joints, Solders, Failure, Fatigue, Alloys, Energy dissipation

Journal Articles

Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

Karl J. L. Geisler, Avram Bar-Cohen

J. Electron. Packag. December 2008, 130(4): 041002.

DOI: https://doi.org/10.1115/1.2993135

Published Online: November 14, 2008

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Topics: Aluminum, Boiling, Heat sinks, Heat, Fins, Thermal conductivity, Critical heat flux, Silicon, Energy dissipation, Heat transfer coefficients

Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai

J. Electron. Packag. September 2007, 129(3): 366–370.

DOI: https://doi.org/10.1115/1.2753988

Published Online: September 12, 2006

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Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature

Journal Articles

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari

J. Electron. Packag. December 2006, 128(4): 305–310.

DOI: https://doi.org/10.1115/1.2351891

Published Online: February 10, 2006

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Topics: Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution

Journal Articles

An Exergy-Based Figure-of-Merit for Electronic Packages

Amip J. Shah, Van P. Carey, Cullen E. Bash, Chandrakant D. Patel

J. Electron. Packag. December 2006, 128(4): 360–369.

DOI: https://doi.org/10.1115/1.2351901

Published Online: December 13, 2005

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Topics: Exergy, Energy dissipation, Junctions, Cooling, Heat sinks, Temperature

Journal Articles

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

Hua Ye, Harry Efstathiadis, Pradeep Haldar

J. Electron. Packag. September 2006, 128(3): 267–272.

DOI: https://doi.org/10.1115/1.2229226

Published Online: August 15, 2005

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Topics: Cooling, Heat, MOSFET transistors, Nitrogen, Simulation, Temperature, Critical heat flux, Junctions, Energy dissipation, Boiling

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Journal citation

NARROW

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

An Exergy-Based Figure-of-Merit for Electronic Packages

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

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