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Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
Published Online: September 28, 2022
... comprehensive analysis and enhanced computational efficiency and modeling simplicity. This framework incorporates a fully integrated electromagnetic circuit (FIEC) model for extracting parasitics, including self and mutual inductances and also exploring their effect on the switching characteristics and power...