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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
...Hsien-Chie Cheng; Yan-Cheng Liu This study introduces a modified dynamic multiphysics modeling framework to characterize the electromagnetic-electrothermal (EET) coupled behavior of a power conversion system during a long load operation. The modeling framework extends the prior model with more...
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of <span class="search-highlight">Power</span> <span class="search-highlight">Conversion</span> <span class="search-highlight">System</span> During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems