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Alan Hedge
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Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A026, August 29–September 1, 2017
Paper No: IPACK2017-74179
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030802.
Paper No: EP-16-1100
Published Online: July 13, 2017
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031003.
Paper No: EP-16-1003
Published Online: May 16, 2016
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Paper No: IPACK2015-48787